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Compact Double-Side Liquid-Impingement-Cooled Integrated Power Electronic Module

Lookup NU author(s): Clare Johnson

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Abstract

This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.


Publication metadata

Author(s): Johnson CM, Buttay C, Rashid SJ, Udrea F, Amaratunga GAJ, Ireland P, Malhan RK

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 19th International Symposium on Power Semiconductor Devices and IC's, ISPSD

Year of Conference: 2007

Pages: 53-56

Publisher: IEEE

URL: http://dx.doi.org/10.1109/ISPSD.2007.4294930

DOI: 10.1109/ISPSD.2007.4294930

Library holdings: Search Newcastle University Library for this item

ISBN: 1424410967


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