Browse by author
Lookup NU author(s): Clare Johnson
Full text for this publication is not currently held within this repository. Alternative links are provided below where available.
This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.
Author(s): Johnson CM, Buttay C, Rashid SJ, Udrea F, Amaratunga GAJ, Ireland P, Malhan RK
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 19th International Symposium on Power Semiconductor Devices and IC's, ISPSD
Year of Conference: 2007
Pages: 53-56
Publisher: IEEE
URL: http://dx.doi.org/10.1109/ISPSD.2007.4294930
DOI: 10.1109/ISPSD.2007.4294930
Library holdings: Search Newcastle University Library for this item
ISBN: 1424410967
