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Lookup NU author(s): Panagiotis Asimakopoulos, Professor Alex Yakovlev
Energy-recovering schemes have been proposed in the literature as an alternative approach to low-power design, while their performance has been demonstrated to be extremely promising when driving large capacitive loads, such as clock distribution networks [1]. This work investigates the potential of the energy-recovering methodology for improving the energy efficiency of through-silicon via (TSV) interconnects in 3D ICs.
Author(s): Asimakopoulos P, Van der Plas G, Yakovlev A, Marchal P
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: IEEE International Conference on 3D Systems Integration
Year of Conference: 2009
Pages: 110-114
Date deposited: 21/05/2010
Publisher: IEEE
URL: http://dx.doi.org/10.1109/3DIC.2009.5306581
DOI: 10.1109/3DIC.2009.5306581
Library holdings: Search Newcastle University Library for this item
ISBN: 9781424445110