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Template and template-free preparation of one-dimensional metallic nanostructures

Lookup NU author(s): Dr Stela Pruneanu, Professor Andrew HoultonORCiD, Dr Ben HorrocksORCiD

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This is the authors' accepted manuscript of an article that has been published in its final definitive form by Springer New York LLC, 2010.

For re-use rights please refer to the publisher's terms and conditions.


Abstract

In this article, we have studied and developed two approaches for organizing metallic nanoparticles into one-dimensional assemblies. The first uses DNA as a 'template' and allows the preparation of various silver nanostructures ('beads-on-a-string' or rod-like wires). The conductance of such nanostructures was demonstrated by employing a powerful technique, Electrostatic Force Microscopy (EFM). This technique gave us 'contactless' information about the electrical properties of silver nanostructures, aligned on a SiO2/Si surface. Additionally, I-V characteristics of a single silver nanowire crossing two microelectrodes were recorded. The nanowire resistivity was estimated at 1.46 x 10(-7) Omega m (at 300 K), which is one order of magnitude higher than that of bulk silver (1.6 x 10(-8) Omega m). The second approach is a 'template-free' one, and exploits the binding ability of l-arginine, which favours the self-assembling of capped gold nanoparticles into gold nanochains. The results suggest that gold nanochains were formed due to dipole-dipole interaction between adjacent nanoparticles, which fuse together through an oriented attachment mechanism. Atomic force microscopy, TEM, UV-vis spectroscopy and X-ray diffraction were used to characterize the morphological, optical and structural properties of these metallic nanostructures.


Publication metadata

Author(s): Pruneanu S, Olenic L, Al-Said SAF, Borodi G, Houlton A, Horrocks BR

Publication type: Article

Publication status: Published

Journal: Journal of Materials Science

Year: 2010

Volume: 45

Issue: 12

Pages: 3151-3159

Print publication date: 02/03/2010

Date deposited: 23/07/2010

ISSN (print): 0022-2461

ISSN (electronic): 1573-4803

Publisher: Springer New York LLC

URL: http://dx.doi.org/10.1007/s10853-010-4320-z

DOI: 10.1007/s10853-010-4320-z


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