ePrints

Application of a micromechanical test structure to the measurement of stress in an electroplated permalloy film

Lookup NU author(s): Dr Alton Horsfall

Downloads

Full text for this publication is not currently held within this repository. Alternative links are provided below where available.

Abstract

Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.

Publication metadata

Author(s): Smith S, Brockie N, Terry J, Wang N, Horsfall A, Walton A

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: IEEE International Conference on Microelectronic Test Structures

Year of Conference: 2009

Pages: 75-80

Publisher: IEEE

URL: http://dx.doi.org/10.1109/ICMTS.2009.4814614

DOI: 10.1109/ICMTS.2009.4814614

Library holdings: Search Newcastle University Library for this item

ISBN: 9781424442591

Share