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Finite element modeling of copper wire bonding on a stacked-die in semiconductor Devices

Lookup NU author(s): Dr Kheng-Lim GohORCiD

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Author(s): Tam XK, Pasbakhsh P, Guo NQ, Ismail N, Goh KL

Publication type: Article

Publication status: Published

Journal: International Journal of Computer Theory and Engineering

Year: 2013

Volume: 5

Issue: 6

Pages: 924-927

Print publication date: 01/12/2013

ISSN (print): 1793-8201

ISSN (electronic): 1793-821X

Publisher: International Association of Computer Science and Information Technology

URL: http://dx.doi.org/10.7763/IJCTE.2013.V5.824

DOI: 10.7763/IJCTE.2013.V5.824

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