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Lookup NU author(s): Dr Xiuyun Zhou,
Professor Gui Yun TianORCiD
This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.
Author(s): Zhou X, Zhou J, Tian G, Wang Y
Publication type: Article
Publication status: Published
Online publication date: 13/10/2015
Acceptance date: 14/09/2015
Date deposited: 21/03/2016
ISSN (electronic): 1424-8220
Publisher: MDPI AG
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