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A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores

Lookup NU author(s): Ammar Karkar, Dr Terrence Mak, Professor Alex Yakovlev



This is the of an article that has been published in its final definitive form by Institute of Electrical and Electronics Engineers, 2016.

For re-use rights please refer to the publisher's terms and conditions.


Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and can satisfy different demands in terms of performance, cost and reliability. Currently, interconnects based on metal are reaching performance limits given relentless technology scaling. In particular, a performance bottleneck has emerged due to the demands for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures have been proposed as alternatives and emerging interconnects including the use of optics or radio frequency (RF). This article presents a comprehensive survey of these various interconnect fabrics, and discusses their current and future potentials and obstacles as well. This article aims to drive the research community to achieve a better utilization of the merits of on-chip interconnects and addresses the challenges involved. New interconnect technologies, such as optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are discussed, evaluated and compared. Consequently, these emerging interconnects can continue to provide the cost efficiency and performance that are highly demanded for future many-core processors and high performance computing.

Publication metadata

Author(s): Karkar A, Mak T, Tong KF, Yakovlev A

Publication type: Article

Publication status: Published

Journal: IEEE Circuits and Systems Magazine

Year: 2016

Volume: 16

Issue: 1

Pages: 58-72

Online publication date: 12/02/2016

Acceptance date: 01/01/1900

ISSN (print): 1531-636X

ISSN (electronic): 1558-0830

Publisher: Institute of Electrical and Electronics Engineers


DOI: 10.1109/MCAS.2015.2510199


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