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Lookup NU author(s): Professor Patrick Degenaar
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We report on the flip-chip packaging of 90x90 arrays of addressable microLEDs onto CMOS circuitry by a solder reflow process. The substrate emitting microLEDs were parabolically shaped and fabricated on free-standing GaN. The individual emitters were 15 mu m in diameter with an array pitch of 80 mu m where all bond pads were given a gold finish. The solder balls were dispensed onto the CMOS pads with an automated PacTech solder dispenser that dispensed 50 mu m diameter solder spheres with a composition of Sn (96.5%)-Ag-(3%)-Cu (0.5%). After alignment of the LED array on top of the CMOS chip, the solder was reflowed at a temperature of 260 degrees C in nitrogen ambient. The completed assemblies form micro-displays that can display computer generated patterns designed for the stimulation of neural cells. The displays were designed to be mounted on the camera port of a microscope to project the emitted light onto neural tissue.
Author(s): Akhter M, Lee JS, Maaskant PP, Rensing M, Nudds N, O'Brien P, Degenaar P, Corbett B
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 2015 European Microelectronics Packaging Conference (EMPC)
Year of Conference: 2015
Print publication date: 01/01/2015
Online publication date: 28/01/2016
Acceptance date: 01/01/1900
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