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Mixed wire and surface-wave communication fabrics for decentralized on-chip multicasting

Lookup NU author(s): Ammar Karkar, Dr Terrence Mak, Professor Alex Yakovlev


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© 2015 EDAA. Network-on-chip (NoC) has emerged to tackle different on-chip challenges and has satisfied different demands in terms of high performance, economical and reliable interconnect implementation. However, a merely metal-based interconnect reaches performance bound with the relentless technology scaling. Especially, it displayed a bottleneck to meet the communication bandwidth demand for multicasting. This paper proposes a novel hybrid architecture, which improves the on-chip communication bandwidth significantly using mixed wires and surface wave interconnects (SWI) fabrics. In particular, the bandwidth of multicasting can be drastically improved. We introduce a decentralized arbitration method to fully utilize the slack-time scheduling with deadlock-free flow control. Evaluation results, based on a cycle-accurate and hardware-based simulation, demonstrate the effectiveness of the proposed architecture and methods. Compared to a wire-based NoC, the mixed fabric approach can achieve an improvement in power reduction and communication speed up to 63% and 12X, respectively. These results are achieved with almost negligible hardware overheads. This new paradigm efficiently addresses the emerged challenges for on-chip communications.

Publication metadata

Author(s): Karkar A, Tong K-F, Mak T, Yakovlev A

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Design, Automation and Test in Europe Conference & Exhibition (DATE) 2015

Year of Conference: 2015

Pages: 794-799

Online publication date: 23/04/2015

Acceptance date: 01/01/1900

Publisher: Institute of Electrical and Electronics Engineers Inc.


DOI: 10.7873/DATE.2015.0276

Library holdings: Search Newcastle University Library for this item

ISBN: 9783981537048