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Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

Lookup NU author(s): Zheng Tan

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Abstract

© 2016, Institution of Engineering and Technology. All rights reserved. For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.

Publication metadata

Author(s): Chen H, Cao W, Tan Z, Bordignon P, Yi R, Zhang H

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 8th International Conference on Power Electronics, Machine and Drives

Year of Conference: 2016

Pages: -

Online publication date: 10/11/2016

Acceptance date: 02/04/2016

Publisher: Institution of Engineering and Technology

URL: http://doi.org/10.1049/cp.2016.0225

DOI: 10.1049/cp.2016.0225

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