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Improved mechanical and thermomechanical properties of alumina substrate via iron doping

Lookup NU author(s): Dr Stevin PramanaORCiD

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Abstract

We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening.© 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Publication metadata

Author(s): Made RI, Phua EJR, Pramana SS, Wong CC, Chen Z, Tok AIY, Gan CL

Publication type: Article

Publication status: Published

Journal: Scripta Materialia

Year: 2013

Volume: 68

Issue: 11

Pages: 869-872

Print publication date: 01/06/2013

Online publication date: 21/02/2013

ISSN (print): 1359-6462

Publisher: Pergamon Press

URL: https://doi.org/10.1016/j.scriptamat.2013.02.032

DOI: 10.1016/j.scriptamat.2013.02.032

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