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Lookup NU author(s): Dr Stevin PramanaORCiD
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The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics. © 2009 Acta Materialia Inc.
Author(s): Xu H, Liu C, Silberschmidt VV, Pramana SS, White TJ, Chen Z
Publication type: Article
Publication status: Published
Journal: Scripta Materialia
Print publication date: 01/07/2009
Online publication date: 21/03/2009
ISSN (print): 1359-6462
ISSN (electronic): 1872-8456
Publisher: Pergamon Press
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