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Lookup NU author(s): Dr Stevin PramanaORCiD
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This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Author(s): Xu H, Liu C, Silberschmidt VV, Pramana SS, White TJ, Chenc Z, Acoffa VL
Publication type: Article
Publication status: Published
Journal: Scripta Materialia
Print publication date: 01/10/2011
Online publication date: 08/07/2011
ISSN (print): 1359-6462
ISSN (electronic): 1872-8456
Publisher: Pergamon Press
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