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Field-Dependent Electrical and Thermal Transport in Polycrystalline WSe2

Lookup NU author(s): Dr Toby HallamORCiD

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This is the authors' accepted manuscript of an article that has been published in its final definitive form by Wiley-VCH Verlag, 2018.

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Abstract

© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. Owing to their desirable electrical and thermoelectric properties, transition metal dichalcogenides (TMDs) have attracted significant attention. It is important to develop an easy synthetic method and a simple device fabrication process for TMDs. In this study, WSe2 films were synthesized on a large scale by thermally assisted conversion (TAC) of W films on SiO2/Si substrates at 600 °C. The TAC process yields homogeneous polycrystalline films of controlled thickness over large areas which have the advantage that they can be adapted for mass production for applications in electronics and thermoelectrics. In this regard, pre-patterning of the deposited metal films allows for devices to be easily fabricated without any etch process. UV-lithography-defined W structures have been deposited and after conversion to WSe2 their electrical and thermoelectric properties have been studied. Using e-beam lithography, a field effect transistor (FET) with a WSe2 channel was fabricated. This showed p-type behavior and reasonable field effect mobility value. The thermoelectric properties of WSe2 thin films were analyzed by additionally integrating micro heating elements to the WSe2 FET. The maximum Seebeck coefficient and power factor (S2·σ) values were calculated to be ≈61 mV·K-1 (Vg = 45 V) and ≈1.3 nW·K-2·cm-1, respectively.


Publication metadata

Author(s): Kim W, Kim H, Hallam T, McEvoy N, Gatensby R, Nerl HC, O'Neill K, Siris R, Kim G-T, Duesberg GS

Publication type: Article

Publication status: Published

Journal: Advanced Materials Interfaces

Year: 2018

Volume: 5

Issue: 11

Print publication date: 08/06/2018

Online publication date: 15/03/2018

Acceptance date: 21/01/2018

Date deposited: 04/06/2018

ISSN (electronic): 2196-7350

Publisher: Wiley-VCH Verlag

URL: https://doi.org/10.1002/admi.201701161

DOI: 10.1002/admi.201701161


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Funding

Funder referenceFunder name
15/IA/3131
12/RC/2278
604391
NRF‐2017M3A7B4049119

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