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Lookup NU author(s): Mohammed Al-DalooORCiD,
Professor Alex Yakovlev
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© 2018 IEEE. Several techniques related to the interconnect structure analysing and the modelling were outlined. Emphasis has been placed on modelling approach, starting from a one-dimensional and simple lumped issue and stretching to be a more general three-dimensional nonuniform problem. In addition, the advantages and disadvantages of each approach have highlighted to state the importance of these models for further research and their prospects. That verified through studying the approaches principles and an uncomplicated comparison.
Author(s): Al-daloo M, Soltan A, Yakovlev A
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 7th International Conference on Modern Circuits and Systems Technologies (MOCAST 2018)
Year of Conference: 2018
Online publication date: 11/06/2018
Acceptance date: 07/05/2018
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