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Lookup NU author(s): Dr Shayan SeyedinORCiD
This is the authors' accepted manuscript of an article that has been published in its final definitive form by Wiley, 2020.
For re-use rights please refer to the publisher's terms and conditions.
Free‐standing films that display high strength and high electrical conductivity are critical for flexible electronics, such as electromagnetic interference (EMI) shielding coatings and current collectors for batteries and supercapacitors. 2D Ti3C2Tx flakes are ideal candidates for making conductive films due to their high strength and metallic conductivity. It is, however, challenging to transfer those outstanding properties of single MXene flakes to macroscale films as a result of the small flake size and relatively poor flake alignment that occurs during solution‐based processing. Here, a scalable method is shown for the fabrication of strong and highly conducting pure MXene films containing highly aligned large MXene flakes. These films demonstrate record tensile strength up to ≈570 MPa for a 940 nm thick film and electrical conductivity of ≈15 100 S cm−1 for a 214 nm thick film, which are both the highest values compared to previously reported pure Ti3C2Tx films. These films also exhibit outstanding EMI shielding performance (≈50 dB for a 940 nm thick film) that exceeds other synthetic materials with comparable thickness. MXene films with aligned flakes provide an effective route for producing large‐area, high‐strength, and high‐electrical‐conductivity MXene‐based films for future electronic applications.
Author(s): Zhang J, Kong N, Uzun S, Levitt A, Seyedin S, Lynch PA, Qin S, Han M, Yang W, Liu J, Wang X, Gogotsi Y, Razal JM
Publication type: Article
Publication status: Published
Journal: Advanced Materials
Print publication date: 12/06/2020
Online publication date: 20/04/2020
Acceptance date: 19/03/2020
Date deposited: 08/07/2020
ISSN (print): 0935-9648
ISSN (electronic): 1521-4095
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