## Temperature Estimation of SiC Power Devices using High Frequency Chirp Signals

### Downloads

- Published version [.pdf]

### Licence

This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).

### Abstract

Silicon Carbide (SiC) devices have become increasingly popular in electric vehicles (EV) predominantly due to their high-switching speed allowing the construction of smaller power converters. Like silicon-based (Si) power switches, knowledge of the junction temperature, (TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. Silicon Carbide (SiC) devices have become increasingly popular in electric vehicles (EV) predominantly due to their high-switching speed allowing the construction of smaller power converters. Like silicon-based (Si) power switches, knowledge of the junction temperature, (TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. Silicon Carbide (SiC) devices have become increasingly popular in electric vehicles (EV) predominantly due to their high-switching speed allowing the construction of smaller power converters. Like silicon-based (Si) power switches, knowledge of the junction temperature, (TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. Silicon Carbide (SiC) devices have become increasingly popular in electric vehicles (EV) predominantly due to their high-switching speed allowing the construction of smaller power converters. Like silicon-based (Si) power switches, knowledge of the junction temperature, (TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. Silicon Carbide (SiC) devices have become increasingly popular in electric vehicles (EV) predominantly due to their high-switching speed allowing the construction of smaller power converters. Like silicon-based (Si) power switches, knowledge of the junction temperature, (TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter. TjTj) can be gained by measuring temperature sensitive electrical parameters (TSEP). This paper presents a new technique to estimate TjTj for a single-chip SiC MOSFET device. High-frequency chirp signals below the resonant frequency of the gate source impedance are injected into the gate of a discrete SiC device during its off-state operation. The gate-source voltage frequency response is captured and processed using the Fast Fourier Transform (FFT). In a second step, data is accumulated and presented over the chirp frequency spectrum. The result is a linear relationship between the processed gate-source voltage and TjTj. The effectiveness of the proposed TSEP is demonstrated in a laboratory scenario, where chirp signals are injected in a stand-alone biased discrete SiC module and in-field scenario where the TSEP is applied to a MOSFET operating in a DC/DC converter.

### Publication metadata

**Author(s): **Lu X, Pickert V, Al-Greer M, Chen C, Wang X, Tsimenidis C

**Publication type: **Article

**Publication status:** Published

**Journal: **Energies

**Year: **2021

**Volume: **14

**Issue: **16

**Online publication date: **11/08/2021

**Acceptance date: **06/08/2021

**Date deposited: **30/08/2021

**ISSN (electronic): **1996-1073

**Publisher: **MDPI

**URL: **https://doi.org/10.3390/en14164912

**DOI: **10.3390/en14164912

### Altmetrics

### Actions

### Share