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Comparison of TSEP Performances Operating at Homogeneous and Inhomogeneous Temperature Distribution in Multichip IGBT Power Modules

Lookup NU author(s): Professor Volker Pickert, Dr Bing Ji



This is the authors' accepted manuscript of an article that has been published in its final definitive form by IEEE, 2021.

For re-use rights please refer to the publisher's terms and conditions.


Temperature Sensitive Electrical Parameters (TSEPs) are used to determine the chip temperature of a singlechip IGBT power module by measuring one electrical device parameter. Commonly, most TSEPs have a linear relationship between the chip temperature and the electrical parameter. Like any sensor, preferred attributes of TSEPs include good accuracy, linearity, and sensitivity. For multichip Insulated Gate Bipolar Transistors (mIGBTs) modules, these can only be achieved when all chips have the same temperature. Equal chip temperatures among different semiconductor chips can be achieved when placing mIGBTs in environmental chambers to produce a homogeneous temperature distribution (HTD). In real applications, however, mIGBTs are power cycled and are exposed to inhomogeneous temperature distribution (ITD) where temperature differences exist between chips. Consequently, measuring one electric parameter only cannot represent each chip temperature which impacts the TSEP sensitivity, linearity, and accuracy. This paper compares the performance of ten TSEPs applied to a mIGBT module operating at HTD and ITD conditions in order to determine which TSEPs are most suitable for mIGBTs in real applications

Publication metadata

Author(s): Chen C, Pickert V, Ji B, Ji C, Knoll A, Ng C

Publication type: Article

Publication status: Published

Journal: IEEE Journal of Emerging and Selected Topics in Power Electronics

Year: 2021

Volume: 9

Issue: 5

Pages: 6282-6292

Print publication date: 01/10/2021

Online publication date: 28/12/2020

Acceptance date: 20/12/2020

Date deposited: 30/08/2021

ISSN (print): 2168-6777

ISSN (electronic): 2168-6785

Publisher: IEEE


DOI: 10.1109/JESTPE.2020.3047738


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