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Lookup NU author(s): Professor Gui Yun TianORCiD, Changrong YangORCiD
This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).
© 2023 Elsevier Ltd. Sensors’ signal conditioning and digital interface are important for sensor technologies, digital transformation, and the Internet of Things (IoT) in particular. Frequency output sensors and inductance-to-digital converters (LDC) offer distinct advantages over Analog-to-Digital Converter (ADC) interfaces. To miniaturize the eddy current testing system and achieve multi-parameter measurements, this paper reviews eddy current signal conditioning and digital interfaces in the field of displacement sensors and non-destructive tests & evaluation (NDT&E). After review and comparison of different signal conditioning and digital interfaces, the LDC chip is used in eddy current testing for multiple parameter measurements including lift-off distance and defect detection. An LDC-based integrative eddy current non-destructive testing method is proposed. The LDC chip provides AC to drive the LC resonator composed of the sensor coil and the parallel capacitor. By measuring the resonance frequency and parallel resistance (Rp) of the LC resonator, the simultaneous measurement of the lift-off distance and the defect is achieved. Based on the method, the testing experiments of two kinds of specimens made of aluminium and steel were carried out under different lift-offs. Experimental results show that both parameters of frequency and Rp of the LC resonator can intuitively reflect the defect depth and lift-off. Frequency- Rp curves can be used to quantify defect depth and lift-off distance and differentiate the material. This work also illustrates an integrated approach of signal conditioning and digital interface for multiple parameters or feature measurement for integrated eddy current NDT&E. The work opens a new way for addressing multiple parameter measurements of eddy current NDT & E including lift-off estimation and defect characterization via digital interfaces. It has the potential to bridge the gaps in metrology of geometry, displacement measurement, and NDT&E for defect detection and material characterization.
Author(s): Tian G, Yang C, Lu X, Wang Z, Liang Z, Li X
Publication type: Article
Publication status: Published
Journal: NDT and E International
Year: 2023
Volume: 138
Print publication date: 01/09/2023
Online publication date: 29/05/2023
Acceptance date: 28/05/2023
Date deposited: 09/08/2023
ISSN (print): 0963-8695
ISSN (electronic): 1879-1174
Publisher: Elsevier Ltd
URL: https://doi.org/10.1016/j.ndteint.2023.102888
DOI: 10.1016/j.ndteint.2023.102888
ePrints DOI: 10.57711/eqfv-t110
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