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Vibration Signal-based Tool Condition Monitoring Using Regularized Sensor Data Modelling and Model Frequency Analysis

Lookup NU author(s): Dr Zepeng LiuORCiD

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This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).


Abstract

IEEETool condition monitoring (TCM) plays a vital role in maintaining product quality and improving productivity in advanced manufacturing. However, complex machining environments often limit the monitoring accuracy of conventional monitoring systems. In the present study, a new diagnostic framework is proposed for TCM during machining using a novel regularization-based sensor data modelling and model frequency analysis. For the first time, the physical information of the underlying machining process is incorporated into the modelling procedure for the design of the associated regularization parameter. This ensures that significant underlying physics can be taken into account during the modelling so as to enhance the TCM performance. This idea is referred to as tool condition monitoring-oriented regularization (TCMoR). After a model has been identified from TCMoR-based sensor data modelling, the frequency domain properties of the model are extracted to reveal unique and physically meaningful features of the underlying machining process for the TCM purpose. The effectiveness of the proposed diagnostic framework is validated by extensive in-situ experimental studies under both variable and controlled tool-workpiece engagement conditions, demonstrating its advantages over conventional TCM methods and its potential applications in industry.


Publication metadata

Author(s): Liu Z, Lang Z, Gui Y, Zhu Y, Laalej H, Curtis D

Publication type: Article

Publication status: Published

Journal: IEEE Transactions on Instrumentation and Measurement

Year: 2024

Volume: 73

Print publication date: 01/01/2024

Online publication date: 18/12/2023

Acceptance date: 30/11/2023

Date deposited: 14/02/2024

ISSN (print): 0018-9456

ISSN (electronic): 1557-9662

Publisher: Institute of Electrical and Electronics Engineers Inc.

URL: https://doi.org/10.1109/TIM.2023.3343825

DOI: 10.1109/TIM.2023.3343825

ePrints DOI: 10.57711/xk0v-8996


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Funding

Funder referenceFunder name
Engineering and Physical Sciences Research Council EP/T024291/1

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