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Hot-pressed Mn-doped Pb((Zr_0.3Ti_0.7)_0.99Mn_0.01)_O3/polystyrene composites with improved dielectric and energy storage performance

Lookup NU author(s): Sunanda Roy

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Abstract

© 2024 Elsevier LtdPolymer composite films are superb dielectrics with high energy storage performance. Accordingly, herein we fabricated thick dumbbell-shaped 0–3 composites by incorporating Pb((Zr0.3Ti0.7)0.99Mn0.01)O3 (PMZT) as filler (0 –20% by weight) into a polystyrene (PS) matrix, using a two-step, solvent-free method involving melt mixing and subsequent hot pressing. The effects of processing parameters, acceptor doping in the filler, and filler content on the thermal, dielectric, and energy storage properties of the composites were investigated. IR spectroscopy and X-ray diffraction studies confirm the successful integration of the perovskite PMZT ceramic into the PS matrix. Notably, the composite morphology displayed a uniform distribution of filler particles, devoid of voids or agglomerates, indicating effective filler reinforcement. Mn ions acting as acceptor dopants in the ceramic filler, enhance the dielectric constant of the PMZT/PS composites while significantly minimizing the dielectric loss. The hot-pressing method promotes the alignment of dipoles of the filler particles within the composites, leading to stronger polarization and enhanced overall dielectric and ferroelectric response. Remarkably, the 20 wt% PMZT/PS composite exhibits an increased maximum polarization of 0.42 µC/cm2 and an 83% energy storage efficiency, making it a promising candidate for energy storage application.

Publication metadata

Author(s): Shalu S, Mukherjee A, Roy S, Kar P, Kushvaha DK, Rout SK, Dasgupta Ghosh B

Publication type: Article

Publication status: Published

Journal: Materials Today Communications

Year: 2024

Volume: 38

Print publication date: 15/01/2024

Online publication date: 28/12/2023

Acceptance date: 25/12/2023

ISSN (electronic): 2352-4928

Publisher: Elsevier Ltd

URL: https://doi.org/10.1016/j.mtcomm.2023.107974

DOI: 10.1016/j.mtcomm.2023.107974

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