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Novel Impedance Sensing via Semiconductor Strain Gauge and Magnetic Resonant Coupling for Wireless Force Measurement

Lookup NU author(s): Changrong YangORCiD, Emeritus Professor Gui Yun Tian, Qiuping Ma, Dr Lawal Umar Daura, Emmanuel Ibrahim

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This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).


Abstract

Wireless force measurement (WFM) can be used for those scenarios where cable connection and power supply are not available, such as wheel rail force measurement. To enhance the sensitivity and extend the lift-off (the distance between the Tx and Rx) for WFM, this paper introduces a novel approach based on impedance sensing through magnetic resonant coupling (MRC), coupled with a semiconductor strain gauge (SSG), and measured by a developed inductance to digital converter (LDC)-based system. Initially, a simulation was performed to investigate the influence of SSG at various coupling coefficients using parallel-parallel (PP) and series-parallel (SP) MRC topologies. Subsequently, the experiment conducted loading tests on a carbon steel specimen. A traditional strain gauge (SG) was also compared with the SSG in the same experimental set-up. Additionally, the response and sensitivity of the two topologies were analysed at various lift-offs and SSGs. The results demonstrate that the approach based on impedance sensing, MRC, and a miniaturized LDC-based system achieved WFM with high sensitivity and high lift-offs. Both equivalent parallel resistance (RPeq) and resonant frequency (fres) exhibited an excellent linear relationship with the force. The sensitivity in RPeq was found to be relatively stable near the critical coupling region, while fres exhibited only an exponential curve. SSGs affected the optimal lift-off for both PP and SP topologies. The proposed approach is highly suitable for WFM, offering low cost, portability, and fast response advantages.


Publication metadata

Author(s): Yang C, Tian G, Robinson M, Ma Q, Daura LU, Ibrahim ET

Publication type: Article

Publication status: Published

Journal: IEEE Transactions on Instrumentation and Measurement

Year: 2025

Pages: Epub ahead of print

Online publication date: 19/03/2025

Acceptance date: 02/04/2018

Date deposited: 09/04/2025

ISSN (print): 0018-9456

ISSN (electronic): 1557-9662

Publisher: IEEE

URL: https://doi.org/10.1109/TIM.2025.3552864

DOI: 10.1109/TIM.2025.3552864


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Funding

Funder referenceFunder name
China Scholarship Council (CSC NO. 202006070014)
NSFC International Collaboration and Exchange Project, Grant number 61960206010

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