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Biomechanical Evaluation of Three Dimensionally Printed Passive Transfemoral Leg Socket Compliance with ISO 10328: A Comparison of Two Different Designs

Lookup NU author(s): Dr Jennifer OlsenORCiD, Dr Kheng-Lim GohORCiD

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC BY-NC-ND).


Abstract

Malaysia’s need for 200,000 prosthetic legs demands efficient production processes and three-dimensional (3D) printing can potentially address this. Despite the advantages of pin-lock sockets in below-knee prosthetics, research on their application in transfemoral amputations remains limited. This study designs and compares conventional and pinlock prosthetic leg sockets for transfemoral amputees using 3D scanning, modeling, and printing. Conventional and pinlock transfemoral leg sockets at 6 mm were designed using 3-Matic software. Their biomechanical properties were tested via ISO 10328 compression testing on the Instron 8874 machine. Results indicated that pin-lock sockets had higher average Young’s modulus (36.27%) and yield strength (43.53%) compared to conventional designs. However, ultimate compressive strength (UCS) showed no statistically significant difference between the designs (p> 0.05). Practical benefits like user stability and comfort might favor the pin-lock design. Future research should consider larger sample sizes and additional gait phases for comprehensive evaluation.


Publication metadata

Author(s): Nazemi N, Shahril A, Baharuddin M, Samad M, Olsen J, Goh KL, Swain S, Abdullah A, Jamaluddin M, Ramlee M

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: International Exchange and Innovation Conference on Engineering & Science (IEICES)

Year of Conference: 2024

Pages: 659-665

Online publication date: 17/10/2024

Acceptance date: 22/06/2024

Date deposited: 11/12/2025

Publisher: International Exchange and Innovation Conference on Engineering & Sciences

URL: https://doi.org/10.5109/7323332

DOI: 10.5109/7323332


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