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Integrated thermal management techniques for high power electronic devices

Lookup NU author(s): Ryan McGlen, Dr Roshan Jachuck, Shih-Yuan Lin

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Abstract

Within the electronics industry, miniaturisation of silicon components and enhanced performance has led to high power electronic devices with high packing densities. This has identified the future development of very high heat flux components. This paper reviews the development of micro-processing technology and presents a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems. It also presents a research project being carried out at Newcastle University to develop micro-channel heat exchanger technology. © 2004 Elsevier Ltd. All rights reserved.

Publication metadata

Author(s): McGlen RJ, Jachuck R, Lin S

Publication type: Article

Publication status: Published

Journal: Applied Thermal Engineering

Year: 2004

Volume: 24

Issue: 8-9

Pages: 1143-1156

ISSN (print): 1359-4311

ISSN (electronic): 1873-5606

Publisher: Pergamon

URL: http://dx.doi.org/10.1016/j.applthermaleng.2003.12.029

DOI: 10.1016/j.applthermaleng.2003.12.029

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