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Design of a test facility and micro-channel heat exchanger prototype for high power electronic components

Lookup NU author(s): Ryan McGlen, Dr Jonathan Lee

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Abstract

Increased processing speed, miniaturisation and higher packing densities of electronic processing chips has lead to the development of high power, high heat flux electronics cards used by the telecom and server industries to process digital signals. The drive towards higher system performance has put a large demand on forced air convection cooling techniques and is heading towards the thermal limit of the technology. Thermal management is becoming the limiting factor in the development of higher power electronic devices. To meet future heat transfer demands, innovative methods of thermally managing electronic devices are required. This paper looks at the creation of a test facility and single phase, prototype micro-channel heat exchanger design to cool high power silicon and optical chips. Copyright © 2005 by ASME.


Publication metadata

Author(s): McGlen RJ, Lee J, Buffone C

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005

Year of Conference: 2005

Pages: 209-214

Publisher: American Society of Mechanical Engineers

Library holdings: Search Newcastle University Library for this item

ISBN: 9780791841853


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