Post Metallization Annealing Characterization of Interface Properties of High-kappa Dielectrics Stack on Silicon Carbide

Weng, MH; Mahapatra, R; Wright, NG; Horsfall, AB

doi:10.4028/www.scientific.net/MSF.600-603.771

Post Metallization Annealing Characterization of Interface Properties of High-kappa Dielectrics Stack on Silicon Carbide

Lookup NU author(s): Dr Ming-Hung Weng, Dr Rajat Mahapatra, Professor Nick Wright, Dr Alton Horsfall

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Abstract

The interface properties of TiO2/SiO2/SiC metal-insulator-semiconductor (MIS) capacitors were investigated by C-V and G-V measurements over a range of frequencies between 10 kHz and 1 MHz from room temperature up to 500 degrees C. Ledges from Multiple traps were observed during high frequency (I MHz) sweeps from inversion to accumulation during measurements at elevated temperatures. The high measuring temperature resulted in the annealing of the sample, where the existence of trap ledges was observed to be temperature dependent. For n-type substrate negative Q(f) causes the shift of the C-V curve to more negative gate bias with respect to the ideal C-V curve. These fixed oxide charge is substantially reduced after post metallization annealing (PMA). We report the flat band voltage, detail in reducing fixed oxide charge and temperature dependence of density of interface traps before and after annealing of TiO2 high-kappa gate dielectric stacks on a 4H-SiC based device.