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Demonstration of a Sub-micron Damascene Cu/Low-k Mechanical Sensor to Monitor Stress in BEOL Metallization

Lookup NU author(s): Christopher Wilson, Dr Alton Horsfall, Professor Anthony O'Neill

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Abstract

This work reports the results of a mechanical sensor to monitor stress in 100 nm critical dimension Cu interconnects. Existing methodology developed for larger scale Al sensors is discussed and evaluated for Cu/SiO2 and Cu/Low-k integration schemes. New sensor release methods are then developed and the Cu sensor is demonstrated in single and dual damascene technology. We also demonstrate the sensor is sensitive to process modifications and a viable tool for monitoring stress in the Cu back end of line stack.

Publication metadata

Author(s): Wilson CJ, Croes K, Tokei Z, Beyer GP, Horsfall AB, O'Neill AG

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: IEEE International Conference on Microelectronic Test Structures (ICMTS 2009)

Year of Conference: 2009

Pages: 31-35

Date deposited: 20/05/2010

Publisher: IEEE

URL: http://dx.doi.org/10.1109/ICMTS.2009.4814604

DOI: 10.1109/ICMTS.2009.4814604

Library holdings: Search Newcastle University Library for this item

ISBN: 9781424442591

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