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A simple model for the study of the tolerance of interfacial crack under thermal load

Lookup NU author(s): Dr Jishan Zhang, Professor Brian Shaw

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Abstract

Thermal stresses due to a mismatch between material properties may induce failure of a bonded interface. A simple model for linear dissimilar elastic bonded solids containing an interfacial Zener–Stroh crack under a uniform temperature shift is proposed. Its solution is derived. This result may provide some information about the interface defect tolerant size, which ismainly responsible for triggering interface failures under thermal load. Thus, it can be used to assess the interface integrity and reliability under thermal load. On the other hand, the practical interface crack.

Publication metadata

Author(s): Ma L, He R, Zhang J, Shaw B

Publication type: Article

Publication status: Published

Journal: Acta Mechanica

Year: 2013

Volume: 224

Issue: 7

Pages: 1571-1577

Print publication date: 01/07/2013

ISSN (print): 0001-5970

ISSN (electronic): 1619-6937

Publisher: Springer

URL: http://dx.doi.org/10.1007/s00707-013-0820-7

DOI: 10.1007/s00707-013-0820-7

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