Toggle Main Menu Toggle Search

Open Access padlockePrints

Effect of Fluorosurfactant Additive during Cu-Sn Codeposition from Methanesulfonic Acid

Lookup NU author(s): Dr Naray Pewnim, Professor Sudipta Roy


Full text for this publication is not currently held within this repository. Alternative links are provided below where available.


Methanesulfonic acid (MSA) is an interesting supporting electrolyte with many desirable properties such as high salt solubility, high conductivity, low corrosivity and toxicity. Various additives or complexing agents such as brighteners, antioxidants, and surfactants are required for deposition of Sn and Cu-Sn alloys. It has been shown that the simplest electrolyte for successful Cu-Sn deposition can contain just an antioxidant and a fluorosurfactant. In this work we have further examined the role of fluorosurfactant in shifting the electrochemical reduction potential for the more noble metal. The surface adsorption and desorption processes of the surfactant has been inferred through the use of an electrochemical quartz crystal nanobalance (EQCN). Cu and Sn have been deposited individually and simultaneously from MSA electrolytes. Mass changes at the quartz crystal have been compared against those calculated from charge consumption. These data show that in MSA electrolytes the adsorption and desorption of the fluorosurfactant to the surface is potential dependent and it suppresses Cu deposition but facilitates Cu-Sn alloy deposition. (C) 2015 The Electrochemical Society.

Publication metadata

Author(s): Pewnim N, Roy S

Publication type: Article

Publication status: Published

Journal: Journal of the Electrochemical Society

Year: 2015

Volume: 162

Issue: 8

Pages: D360-D364

Online publication date: 16/05/2015

Acceptance date: 01/01/1900

ISSN (print): 0013-4651

ISSN (electronic): 1945-7111

Publisher: Electrochemical Society, Inc.


DOI: 10.1149/2.0551508jes


Altmetrics provided by Altmetric