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Lookup NU author(s): Dr Enrique Escobedo-Cousin, Dr Johannes Gausden, Professor Anthony O'Neill
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© 2023 IMAPS-International Microelectronics and Packaging Society. All rights reserved. It is often assumed that Parylene-C encapsulation films are void-free & conformal by nature of their vapour deposition. We present a case study in an optrode device where voiding occurs; we argue the voids originate from the geometry of the substrate and from the use of surface mount components. The segment under study consists of a commercial LED bonded with Au/Au thermosonic bonding onto a custom silicon substrate. We demonstrate via micro-sectioning that there is polymer voiding behaviour (1) in sub-LED surfaces; and (2) within through-hole vias in the silicon substrate (channels designed to allow polymer vapour ingress during deposition). By making a comparison to the solutions found in the IC industry around tungsten vapour filling of blind vias, we present geometric solutions for failure mitigation.
Author(s): Idil AS, Bailey R, Escobedo-Cousin E, Gausden J, O'Neill A, Donaldson N
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 24th European Microelectronics & Packaging Conference (EMPC23)
Year of Conference: 2023
Pages: 340-344
Online publication date: 07/03/2024
Acceptance date: 02/04/2018
Publisher: International Microelectronics and Packaging Society (IMAPS)
URL: https://doi.org/10.4071/001c.94831
DOI: 10.4071/001c.94831
Series Title: IMAPSource Proceedings
