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Electromigration testing of via terminated test structures

Lookup NU author(s): Professor Anthony O'Neill

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Abstract

In this paper we describe three phenomena that have been observed in via terminated test structures. The first is the effect of stress voiding on the electromigration current density exponent, n. We have tested stress-voided lines and the results show that the current density exponent is close to 1. This is consistent with the prediction that stress-voided lines have a lower lifetime. We propose that the current density exponent must be measured and not assumed for such lines. The second phenomenon is the reservoir effect in via-terminated lines. Void locations following electromigration stressing are shown for a via-terminated structure containing a reservoir, prepared by Focused Ion Beam (FIB), and a discussion of the reservoir effect is presented. Finally, we report on the correlation between void location and the bimodal distribution of failure mechanisms that have been observed.


Publication metadata

Author(s): Low KS, Poetzlberger H, O'Neill A

Publication type: Article

Publication status: Published

Journal: Materials Research Society Symposium - Proceedings

Year: 1999

Volume: 563

Pages: 133-138

Print publication date: 01/01/1999

ISSN (print): 0272-9172

ISSN (electronic): 1946-4274

Publisher: Materials Research Society

URL: http://dx.doi.org/10.1557/PROC-563-133

DOI: 10.1557/PROC-563-133


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