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Lookup NU author(s): Professor Anthony O'Neill
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In this paper we describe three phenomena that have been observed in via terminated test structures. The first is the effect of stress voiding on the electromigration current density exponent, n. We have tested stress-voided lines and the results show that the current density exponent is close to 1. This is consistent with the prediction that stress-voided lines have a lower lifetime. We propose that the current density exponent must be measured and not assumed for such lines. The second phenomenon is the reservoir effect in via-terminated lines. Void locations following electromigration stressing are shown for a via-terminated structure containing a reservoir, prepared by Focused Ion Beam (FIB), and a discussion of the reservoir effect is presented. Finally, we report on the correlation between void location and the bimodal distribution of failure mechanisms that have been observed.
Author(s): Low KS, Poetzlberger H, O'Neill A
Publication type: Article
Publication status: Published
Journal: Materials Research Society Symposium - Proceedings
Print publication date: 01/01/1999
ISSN (print): 0272-9172
ISSN (electronic): 1946-4274
Publisher: Materials Research Society
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