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Co-Ni-Cu/Cu multilayers electrodeposited using a channel flow cell

Lookup NU author(s): Professor Sudipta Roy

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Abstract

Co-Ni-Cu/Cu multilayers were electrodeposited from a single electrolyte using a flow cell with substrate and counter electrode facing each other across a 3 mm wide channel. Substrates were 25 nm Au/3 nm Cr sputtered on glass, and the electrolyte was sulfamate based. The multilayers exhibited giant magnetoresistance (GMR) of up to ∼7%, but only for Cu layer thicknesses ≥3 nm. Potentiostatic deposition gave higher GMR values than galvanostatic deposition. Both varying the flow rate and varying the Cu content of the electrolyte influenced the GMR, which decreased with increasing Cu deposition current. While the flow cell gives much improved control over mass transport, cells relying on natural convection give higher GMR.

Publication metadata

Author(s): Roy S; Nabiyouni G; Kasyutich OI; Schwarzacher W

Publication type: Article

Publication status: Published

Journal: Journal of the Electrochemical Society

Year: 2002

Volume: 149

Issue: 4

Pages: C218-C222

ISSN (print): 0013-4651

ISSN (electronic): 1945-7111

Publisher: Electrochemical Society, Inc.

URL: http://dx.doi.org/10.1149/1.1456923

DOI: 10.1149/1.1456923

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