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Transient electrochemical processes during Cu-Ni deposition

Lookup NU author(s): Dr Wouter Meuleman, Professor Sudipta Roy


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Recent investigations on nanostructured metal multilayers have shown that interfaces between each bi-layer can affect the properties of a multilayer. Transient current and potential data after the application of a potential step or a current step, respectively, during the codeposition of copper and nickel from a citrate electrolyte have been investigated. It has been found that on the application of a current step only copper is reduced at first, followed by the deposition of a copper-nickel alloy. Once the current is switched off, nickel (or a nickel-rich) alloy is dissolved from the deposit due to displacement by copper. Transient potentials and steady-state polarisation data can be used to determine the amount of nickel dissolved from a deposit.

Publication metadata

Author(s): Meuleman WRA, Roy S

Publication type: Article

Publication status: Published

Journal: Transactions of the Institute of Metal Finishing

Year: 2003

Volume: 81

Issue: 2

Pages: 55-58

Print publication date: 01/03/2003

ISSN (print): 0020-2967

ISSN (electronic): 1745-9192

Publisher: Maney Publishing