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Lookup NU author(s): Dr Todd Green,
Professor Sudipta Roy
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The feasibility of using a thiosulfate-sulfite bath to electrodeposit soft gold for microelectronic applications has been investigated. This bath is stable at near-neutral pH. shows good compatibility with positive photoresists, and does not contain any additives. It was found that the bath produced gold bumps with straight sidewalls, flat top surfaces, and a good reproduction of the resist pattern was achieved. The thickness uniformity, roughness, stress, hardness, adhesion, and shape of the plated structures were found to be compatible with the requirements for a wide range of microelectronic applications, including wafer bumping.
Author(s): Green TA, Liew M-J, Roy S
Publication type: Article
Publication status: Published
Journal: Journal of the Electrochemical Society
ISSN (print): 0013-4651
ISSN (electronic): 1945-7111
Publisher: Electrochemical Society, Inc.
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