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Micro-machinability and edge chipping mechanism studies on diamond micro-milling of monocrystalline silicon

Lookup NU author(s): Dr Zi Jie Choong, Dr Dehong Huo, Professor Patrick Degenaar, Professor Anthony O'Neill



This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC BY-NC-ND).


© 2019 The Society of Manufacturing Engineers Excessive generation of undesirable surface and subsurface damages such as surface edge chipping often occurs when monocrystalline silicon, a hard and brittle material, is machined at tens to hundreds of microns in thickness. However, before developing strategies to reduce edge chipping and improve the machining efficiency by micro-milling, understanding of its cutting mechanism is required. In this study, the micro-machinability and edge chipping mechanism on a (001) silicon were investigated by full slot milling using the natural diamond tool. A volumetric measurement technique was also proposed to quantify edge chipping better. Three chipping types: 45° 90° and mixed mode (dominant type) were observed, and its mechanism is attributed to cleavage and slip structure within silicon's crystal architecture. The cutting forces, surface and edge quality were examined and characterised accordingly. From the reported results, the size effect on the specific cutting energy is greatly influenced by the shear strain work hardening of the workpiece. Enhancement of the strain work hardening effect is attributed and demonstrated using small feed rate, high cutting speed and cutting along the [100] feed direction. As a result, good surface quality of Ra = 20 nm and small edge chipping volume of 80 μm3 were achieved.

Publication metadata

Author(s): Choong ZJ, Huo D, Degenaar P, O'Neill A

Publication type: Article

Publication status: Published

Journal: Journal of Manufacturing Processes

Year: 2019

Volume: 38

Pages: 93-103

Print publication date: 01/02/2019

Online publication date: 09/01/2019

Acceptance date: 02/01/2019

Date deposited: 12/03/2019

ISSN (print): 1526-6125

ISSN (electronic): 2212-4616

Publisher: Elsevier Ltd


DOI: 10.1016/j.jmapro.2019.01.004


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