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Lookup NU author(s): Dr Zi Jie Choong, Dr Dehong Huo, Professor Patrick Degenaar, Professor Anthony O'Neill
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC BY-NC-ND).
© 2019 The Society of Manufacturing Engineers Excessive generation of undesirable surface and subsurface damages such as surface edge chipping often occurs when monocrystalline silicon, a hard and brittle material, is machined at tens to hundreds of microns in thickness. However, before developing strategies to reduce edge chipping and improve the machining efficiency by micro-milling, understanding of its cutting mechanism is required. In this study, the micro-machinability and edge chipping mechanism on a (001) silicon were investigated by full slot milling using the natural diamond tool. A volumetric measurement technique was also proposed to quantify edge chipping better. Three chipping types: 45° 90° and mixed mode (dominant type) were observed, and its mechanism is attributed to cleavage and slip structure within silicon's crystal architecture. The cutting forces, surface and edge quality were examined and characterised accordingly. From the reported results, the size effect on the specific cutting energy is greatly influenced by the shear strain work hardening of the workpiece. Enhancement of the strain work hardening effect is attributed and demonstrated using small feed rate, high cutting speed and cutting along the [100] feed direction. As a result, good surface quality of Ra = 20 nm and small edge chipping volume of 80 μm3 were achieved.
Author(s): Choong ZJ, Huo D, Degenaar P, O'Neill A
Publication type: Article
Publication status: Published
Journal: Journal of Manufacturing Processes
Year: 2019
Volume: 38
Pages: 93-103
Print publication date: 01/02/2019
Online publication date: 09/01/2019
Acceptance date: 02/01/2019
Date deposited: 12/03/2019
ISSN (print): 1526-6125
ISSN (electronic): 2212-4616
Publisher: Elsevier Ltd
URL: https://doi.org/10.1016/j.jmapro.2019.01.004
DOI: 10.1016/j.jmapro.2019.01.004
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