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Simple computer modeling of the grain microstructure of Al-4wt%Cu interconnection lines

Lookup NU author(s): Professor Steve BullORCiD, Professor Anthony O'Neill

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Abstract

A simple computer model is proposed to simulate the microstructural evolution of Al-4 wt% Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.

Publication metadata

Author(s): Low KS, Bull SJ, O'Neill AG

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Polycrystalline Thin Films - Structure, Texture, Properties and Applications III

Year of Conference: 1997

Pages: 191-196

ISSN: 0272-9172

Publisher: Materials Research Society

Library holdings: Search Newcastle University Library for this item

ISBN: 1558993762

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