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The Newcastle University research output collection, currently available on ePrints, will shortly be moving to a new open repository platform, Figshare. To prepare for the data migration we have paused adding new content to ePrints, and will resume once the new repository is launched. During this time you will continue to have access to ePrints (but no new content will appear). We will share updates here when available.

Calibration of MEMS-based test structures for predicting thermomechanical stress in integrated circuit interconnect structures

Lookup NU author(s): Kai Wang, Dr Alton Horsfall, Professor Nick WrightORCiD, Professor Anthony O'Neill, Sorin Soare, Professor Steve BullORCiD

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Publication metadata

Author(s): dos Santos JMM, Wang K, Horsfall AB, Pina JCP, Wright NG, O'Neill AG, Soare SM, Bull SJ, Terry JG, Walton AJ, Gundlach AM, Stevenson JTM

Publication type: Article

Publication status: Published

Journal: IEEE Transactions on Device and Materials Reliability

Year: 2005

Volume: 5

Issue: 4

Pages: 713-719

Print publication date: 01/12/2005

Date deposited: 18/04/2008

ISSN (print): 1530-4388

ISSN (electronic): 1558-2574

Publisher: IEEE

URL: http://dx.doi.org/10.1109/TDMR.2005.857218

DOI: 10.1109/TDMR.2005.857218

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