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Lookup NU author(s): Dr Alton Horsfall,
Professor Nick Wright,
Professor Anthony O'Neill,
Professor Steve Bull
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We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.
Author(s): Dos Santos JMM, Horsfall AB, Pina JCP, Wright NG, O'Neill AG, Wang K, Soare SM, Bull SJ, Terry JG, Walton AJ, Gundlach AM, Stevenson JTM
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 42nd Annual IEEE International Reliability Physics Symposium
Year of Conference: 2004
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